import re
 
txt = '''
The first process, called wafer bumping, involves a reflow solder process to form the solder balls on all of the input/output
(I/O) pads on the wafer. Because of the extremely small geometries involved, in some instances this process is best accomplished in a hydrogen atmosphere. RTC offers a high temperature furnace for this application, equipped with the hydrogen package, providing a re-flow process in a 100 hydrogen atmosphere. For a second process, called 
"chip joining", RTC offers both a near infrared or forced convection oven.
'''
 
comb_nextline = re.sub(r'(?<=[^.][A-Za-z,-]) *\n *(?=[a-zA-Z0-9(\"])', ' ', txt)
print(comb_nextline)

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