import re

txt = '''
The first process, called wafer bumping, involves a reflow solder process to form the solder balls on all of the input/output
(I/O) pads on the wafer. Because of the extremely small geometries involved, in some instances this process is best accomplished in a hydrogen atmosphere. RTC offers a high temperature furnace for this application, equipped with the hydrogen package, providing a re-flow process in a 100 hydrogen atmosphere. For a second process, called 
"chip joining", RTC offers both a near infrared or forced convection oven.
'''

comb_nextline = re.sub(r'(?<=[^.][A-Za-z,-]) *\n *(?=[a-zA-Z0-9(\"])', ' ', txt)
print(comb_nextline)